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| 2.4 GHz Power Amplifier SST12LP14 SST12LP142.4 GHz Power Amplifier Preliminary Specifications FEATURES: * High Gain: - Typically 30 dB gain across 2.4~2.5 GHz over temperature 0C to +80C High linear output power: - >26.5 dBm P1dB - Meets 802.11g OFDM ACPR requirement up to 23 dBm - Added EVM ~4% up to 20 dBm for 54 Mbps 802.11g signal - Meets 802.11b ACPR requirement up to 24 dBm High power-added efficiency/Low operating current for both 802.11g/b applications - ~22% @ POUT = 22 dBm for 802.11g - ~26% @ POUT = 23.5 dBm for 802.11b Built-in Ultra-low IREF power-up/down control - IREF <4 mA Low idle current - ~60 mA ICQ High-speed power-up/down - Turn on/off time (10%~90%) <100 ns - Typical power-up/down delay with driver delay included <200 ns * High temperature stability - ~1 dB gain/power variation between 0C to +80C - ~1 dB detector variation over 0C to +80C * Low shut-down current (< 0.1 A) * On-chip power detection * 25 dB dynamic range on-chip power detection * Simple input/output matching * Packages available - 16-contact VQFN (3mm x 3mm) - Non-Pb (lead-free) packages available * * APPLICATIONS: * * * * WLAN (IEEE 802.11g/b) Home RF Cordless phones 2.4 GHz ISM wireless equipment * * * PRODUCT DESCRIPTION The SST12LP14 is a high-performance power amplifier IC based on the highly-reliable InGaP/GaAs HBT technology. The SST12LP14 can be easily configured for high-power, high-efficiency applications with superb power-added efficiency while operating over the 2.4~2.5 GHz frequency band. It typically provides 30 dB gain with 22% poweradded efficiency @ POUT = 22 dBm for 802.11g and 27% power-added efficiency @ POUT = 24 dBm for 802.11b. The SST12LP14 has excellent linearity, typically <4% added EVM up to 20 dBm output power which is essential for 54 Mbps 802.11g operation while meeting 802.11g spectrum mask at 23 dBm. The SST12LP14 also has wide-range (>25 dB), temperature-stable (~1 dB over 80C), single-ended/differential power detectors which lower users' cost on power control. The power amplifier IC also features easy board-level usage along with high-speed power-up/down control. Ultralow reference current (total IREF <4 mA) makes the SST12LP14 controllable by an on/off switching signal directly from the baseband chip. These features coupled with low operating current make the SST12LP14 ideal for the final stage power amplification in battery-powered 802.11g/b WLAN transmitter applications. The SST12LP14 is offered in 16-contact VQFN package. See Figure 1 for pin assignments and Table 1 for pin descriptions. (c)2005 SST Communications Corp. S71279-00-000 1/05 1 The SST logo and SuperFlash are registered Trademarks of Silicon Storage Technology, Inc. These specifications are subject to change without notice. 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications FUNCTIONAL BLOCKS FUNCTIONAL BLOCK DIAGRAM VCC1 NC NC 14 NC 13 12 VCC2 11 RFOUT 10 RFOUT Bias Circuit NC 4 5 VCCb 6 VREF1 7 VREF2 8 Det_ref 1279 B1.1 16 NC RFIN RFIN 1 2 3 15 9 Det (c)2005 SST Communications Corp. S71279-00-000 1/05 2 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications PIN ASSIGNMENTS VCC1 NC NC 14 16 NC RFIN RFIN NC 1 2 3 4 15 NC 13 12 VCC2 11 RFOUT 10 RFOUT 9 Det 8 Det_ref 1279 16-vqfn P1.1 Top View (contacts facing down) RF and DC GND 0 5 VCCb 6 VREF1 7 VREF2 FIGURE 1: PIN ASSIGNMENTS FOR 16-CONTACT VQFN PIN DESCRIPTIONS TABLE 1: PIN DESCRIPTION Symbol GND NC RFIN RFIN NC VCCb VREF1 VREF2 Det_ref Det RFOUT RFOUT VCC2 NC NC NC VCC1 Pin No. 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Power Supply No Connection No Connection No Connection Power Supply PWR No Connection Power Supply PWR PWR PWR O O O O PWR Pin Name Ground No Connection I I Type1 Function The center pad should be connected to RF ground with several low inductance, low resistance vias. Unconnected pins. RF input, DC decoupled RF input, DC decoupled Unconnected pins. Supply voltage for bias circuit 1st stage idle current control 2nd stage idle current control On-chip power detector reference On-chip power detector RF output RF output Power supply, 2nd stage Unconnected pins. Unconnected pins. Unconnected pins. Power supply, 1st stage T1.0 1279 1. I=Input, O=Output (c)2005 SST Communications Corp. 3 S71279-00-000 1/05 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications ELECTRICAL SPECIFICATIONS The AC and DC specifications for the power amplifier interface signals. Refer to Table 2 for the DC voltage and current specifications. Refer to Figures 2 through 12 for the RF performance. Absolute Maximum Stress Ratings (Applied conditions greater than those listed under "Absolute Maximum Stress Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Supply Voltage at pins 5, 12, and 16 (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +4.6V Reference voltage to pin 6 (VREF1) and pin 7 (VREF2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.6V DC supply current (ICC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mA Operating Temperature (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40C to +85C Storage Temperature (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40C to +120C Maximum Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150C Surface Mount Solder Reflow Temperature: . . . . . . . . . . . . . . . . . . . . . . . . . "with-Pb" units1: 240C for 3 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . "non-Pb" units: 260C for 3 seconds 1. Certain "with-Pb" package types are capable of 260C for 3 seconds; please consult the factory for the latest information. OPERATING RANGE Range Industrial Ambient Temp -40C to +85C VCC 3.3V TABLE 2: DC ELECTRICAL CHARACTERISTICS Symbol VCC ICC Supply Current for 802.11g, 24 dBm for 802.11g, 25 dBm ICQ IOFF VREG1 VREG2 VREG1 VREG2 Idle current for 802.11g to meet EVM @ 20.5 dBm Shut down current Reference Voltage for 1st Stage, with 120 resistor Reference Voltage for 2nd Stage, with 360 resistor Reference Voltage for 1st Stage, with 220 resistor Reference Voltage for 2nd Stage, with 590 resistor 2.7 2.7 2.9 2.9 2.9 2.9 3.1 3.1 55 0.1 3.1 3.1 3.3 3.3 290 340 mA mA mA A V V V V T2.0 1279 Parameter Supply Voltage at pins 5, 12, 16 Min. 3.0 Typ 3.3 Max. 4.2 Unit V Test Conditions (c)2005 SST Communications Corp. S71279-00-000 1/05 4 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications TABLE 3: AC ELECTRICAL CHARACTERISTICS FOR CONFIGURATION Symbol FL-U POUT Parameter Frequency range Output power @ PIN = -7 dBm 11b signals @ PIN = -10 dBm 11g signals G GVAR1 GVAR2 ACPR Added EVM 2f, 3f, 4f, 5f Small signal gain Gain variation over band (2400~2485 MHz) Gain ripple over channel (20 MHz) Meet 11b spectrum mask Meet 11g OFDM 54 MBPS spectrum mask @ 20 dBm output with 11g OFDM 54 MBPS signal Harmonics at 22 dBm, without trapping capacitors 23 22 3 -40 0.2 23 20 30 31 33 0.5 dBm dBm dB dB dB dBm dBm % dBc T3.0 1279 Min. 2400 Typ Max. 2485 Unit MHz (c)2005 SST Communications Corp. S71279-00-000 1/05 5 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications TYPICAL PERFORMANCE CHARACTERISTICS TEST CONDITIONS: VCC = 3.3V, TA = 25C FIGURE 2: S-PARAMETERS FIGURE 3: INPUT RETURN LOSS FIGURE 4: IN-BAND GAIN FLATNESS (c)2005 SST Communications Corp. S71279-00-000 1/05 6 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications TYPICAL PERFORMANCE CHARACTERISTICS TEST CONDITIONS: F1 = 2.45 GHZ, F2 = 2.451 GHZ FIGURE 5: POUT VS PIN FIGURE 8: GAIN VS POUT FIGURE 6: IM3 VS POUT FIGURE 9: PAE FOR TWO TONE FIGURE 7: DETECTORS VS POUT (c)2005 SST Communications Corp. S71279-00-000 1/05 7 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications TYPICAL PERFORMANCE CHARACTERISTICS TEST CONDITIONS: VCC = 3.3V, TA = 25C, F = 2.45 GHZ, 54 MBPS 802.11G OFDM SIGNAL FIGURE 10: 802.11G SPECTRUM AT 22/23 DBM, DC CURRENT 210/240 MA FIGURE 11: 802.11G ADDED EVM FOR 54 MBPS 802.11G SIGNAL (c)2005 SST Communications Corp. S71279-00-000 1/05 8 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications FIGURE 12: 802.11B SPECTRUM AT 24 DBM, DC CURRENT CONSUMPTION 280 MA 100pF 0.1 F 0.1 F 4.7 F Vcc 12nH/06 03 16 15 14 13 1 12 100pF 50 RFin 50/150mil 2 11 50 /140mil 100pF 50 RFOUT 2.0pF 3 Bias circuit 4 5 6 7 8 10 2.4pF 9 0.1 F 10pF R1 120 10pF R2 360* 10pF 10pF R1=120, R2=360 and VREG1=VREG2=2.8~3.0V or R1=220, R2=590 and VREG1=VREG2=2.9~3.3V 1279 Schematic.0.1 VREG1 VREG2 Det_ref Det FIGURE 13: TYPICAL SCHEMATIC FOR HIGH-POWER, HIGH-EFFICIENCY 802.11B/G APPLICATIONS (c)2005 SST Communications Corp. S71279-00-000 1/05 9 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications PRODUCT ORDERING INFORMATION SST12LP SSTxxLP 14 xx - QVC - XXX E X Environmental Attribute E1 = non-Pb contact (lead) finish Package Modifier C = 16 contact Package Type QV = VQFN Product Family Identifier Product Type P = Power Amplifier Voltage L = 3.0-3.6V Frequency of Operation 2 = 2.4 GHz Product Line 1 = SST Communications 1. Environmental suffix "E" denotes non-Pb solder. SST non-Pb solder devices are "RoHS Compliant". Valid combinations for SST12LP14 SST12LP14-QVC SST12LP14-QVCE SST12LP14 Evaluation Kits SST12LP14-QVC-K SST12LP14-QVCE-K Note: Valid combinations are those products in mass production or will be in mass production. Consult your SST sales representative to confirm availability of valid combinations and to determine availability of new combinations. (c)2005 SST Communications Corp. S71279-00-000 1/05 10 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications PACKAGING DIAGRAMS TOP VIEW SIDE VIEW 0.2 BOTTOM VIEW See notes 2 and 3 Pin #1 1.7 Pin #1 3.00 0.10 1.7 0.076 0.05 Max 3.00 0.10 1.00 0.80 0.30 0.18 1mm 0.5 BSC 0.45 0.35 Note: 1. Complies with JEDEC JEP95 MO-220I, variant VEED except external paddle nominal dimensions. 2. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch. 3. The external paddle is electrically connected to the die back-side and possibly to certain VSS leads. This paddle can be soldered to the PC board; it is suggested to connect this paddle to the VSS of the unit. Connection of this paddle to any other voltage potential can result in shorts and/or electrical malfunction of the device. 4. Untoleranced dimensions are nominal target dimensions. 5. All linear dimensions are in millimeters (max/min). 16-vqfn-3x3-QVC-0.0 16-CONTACT VERY-THIN QUAD FLAT NO-LEAD (VQFN) SST PACKAGE CODE: QVC TABLE 4: REVISION HISTORY Revision 00 Description Date Jan 2005 * S71279: SST conversion of data sheet GP1214 (c)2005 SST Communications Corp. S71279-00-000 1/05 11 2.4 GHz Power Amplifier SST12LP14 Preliminary Specifications CONTACT INFORMATION Marketing SST Communications Corp. 2951 28th Street, Ste. 2040 Santa Monica, CA 90405 Tel: 310-581-1650 x27 Fax: 310-581-1663 Sales NORTH AMERICA Silicon Storage Technology, Inc. Les Crowder Technical Sales Support - Major Accounts 1922 Colina Salida Del Sol San Clemente, CA 92673-3652 USA Tel: 949-495-6437 Cell: 714-813-6636 Fax: 949-495-6364 E-mail: lcrowder@sst.com EUROPE Silicon Storage Technology Ltd. Ralph Thomson Applications Manager Mark House 9-11 Queens Road Hersham KT12 5LU UK Tel: +44 (0) 1869 321 431 Cell: +44 (0) 7787 508 919 E-mail: rthomson@sst.com JAPAN SST Japan Yashushi Yoshinaga Sales Manager 6F Kose #2, 1-14-20 Shin-Yokohama, Kohoku-ku, Yokohama 222-0033 Kanagawa, Japan Tel: (81) 45-471-1851 Fax: (81) 45-471-3285 Email: yoshi@sst.com ASIA PACIFIC NORTH SST Macao H. H. Chang Senior Director, Sales Room A, 8th Floor, Macao Financial Centre, No. 230-246, Rua Pequim, Macao Tel: (853) 706-022 Fax: (853) 706-023 E-mail: hchang@sst.com ASIA PACIFIC SOUTH SST Communications Co. Andy Chang Director of Sales 2F, No. 415, Tiding Blvd., Sec.2, Neihu, Taipei, Taiwan, R.O.C. Tel: 02-2656-2888 x220 Fax: 02-2656-2889 E-mail: achang@sst.com KOREA SST Korea Charlie Shin Country Manager Rm# 1101 DonGu Root Bldg, 16-2 Sunae-Dong, Bundang-Gu, Sungnam, Kyunggi-Do Korea, 463-020 Tel: (82) 31-715-9138 Fax: (82) 31-715-9137 Email: cshin@sst.com Silicon Storage Technology, Inc. * 1171 Sonora Court * Sunnyvale, CA 94086 * Telephone 408-735-9110 * Fax 408-735-9036 www.SuperFlash.com or www.sst.com (c)2005 SST Communications Corp. S71279-00-000 1/05 12 |
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